ForLab DiFeMis
A project at the KIT Karlsruhe Institute of Technology
Digital manufacturing technologies and innovative concepts for the assembly and connection technology of high-frequency electronic and photonic circuits are being developed by the Karlsruhe Microelectronics Research Laboratory for Manufacturing Technologies of High-Frequency Systems. This research facility is located at the Karlsruhe Institute of Technology (KIT).
The scientists led by Prof. Dr.-Ing. Thomas Zwick are looking for new ways to advance the integration of such circuits. In particular, they are researching innovative packaging solutions that can be efficiently applied to prototypes as well as scaled up to small and medium-sized series.
In the DiFeMiS ForLab, systems for additive and maskless deposition and structuring processes are therefore combined to form a flexible printing platform. This enables electronic and photonic connections between semiconductor ICs and other components to be realised with high performance in the smallest of spaces. The innovative assembly and connection technology enables the cost-effective production of compact modules from semiconductor ICs up to the terahertz range and at optical frequencies.
With their work, the researchers want to close a gap that currently exists in the field of RF packaging. This will also give many small and medium-sized companies the opportunity to develop more efficient and cost-effective products. This can be of great interest for sensors based on radar or lidar technology, for example, if these are required in industrial automation in many different versions and in medium quantities.
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